LASER
Laser microperforation: high-precision solutions for modern packaging
Laserpin develops CO₂ laser microperforation systems designed to ensure extreme precision in plastic film processing. Our laser technology is ideal for modified atmosphere packaging (MAP), food trays, technical bags and multilayer films.
With laser systems, you can achieve:
- Invisible holes (as small as Ø 0.05 mm)
- Lateral multiple perforations
- Custom-shaped cuts and windows
- Laser scoring for controlled opening
Each unit can be integrated inline or used as a standalone machine, and is managed by 4.0-ready software that adjusts beam power, hole shape and position based on the material, line speed and temperature.
TECHNICAL TABLE – LR4 Model
| Parameter | Value |
|---|---|
| Model | LR4 |
| Technology | CO₂ laser (infrared, optimized wavelength) |
| Main applications | MAP, plastic films, technical pouches |
| Compatible materials | LDPE, HDPE, PP, PET, PLA, laminates, paper |
| Hole diameter | Ø 0.05 – 0.3 mm |
| Max speed | Up to 400 m/min |
| Max film thickness | 350 µm |
| Max film width | 2800 mm |
| Pulse frequency | Up to 30 kHz |
| Time resolution | 10 µs |
| Laser scoring | Yes, with depth control |
| Laser source power | Max 360 W |
| Cooling system | Liquid, air, or hybrid |
| Control interface | Dedicated software, encoder, PLC |
| Advanced configurations | Multi-head, variable hole pitch control |
FAQ – Frequently Asked Questions
LASER LR4
LaserPin has invested in Laser technology, designing a unit that meets the requirements of the latest developments in the packaging industry, particularly in modified atmosphere packaging (MAP) and its applications.
LR4 is an ideal model for microperforation and etching of plastic films for range IV and V packaging, allowing for longer shelf life of fresh products.
In-line drilling. Versatile and adaptable solution.
TheLR4 is a machine equipped with a CO2 laser, which emits a pre-set wavelength beam of infrared light. An optical system focuses the beam on a small surface area of the material. The heat generated by the laser sublimates the material, thus creating small holes invisible to the naked eye. The diameter of the holes is adjusted by innovative 4.0 software that establishes the force of the beam on the material, which rotates at a constant speed. The laser unit is then capable of drilling materials with different strengths and thicknesses. It also works on materials made of several layers.
Changing the size of the holes alters the exchange of atmospheric gas between the packaged product and the external environment. Finding the right balance ensures a longer shelf life for fresh product. Software controls the laser pulses. At high frequencies, the laser works continuously while at lower frequencies it creates holes at a predetermined distance. The control system is supported by an encoder and a trigger system.
This means that the software can vary the size of the holes and the distance between them, thus adapting to different materials and requirements. Using the laser with calibrated power, it is possible to weaken the material deeply, reducing the thickness without perforating it, on the direction of the tape. This process is called laser scoring and creates easy opening tears that help the end user. Laserpin is investing in research and development to find better and better solutions for the latest developments in the industry.
MATERIALS
LDPE, HDPE, PP, Laminate, PU, Paper, PVC, Biodegradable, Compostable, PET.
- Maximum Material Passage: 2800 mm
- Maximum Material Thickness: 350 microns
- Maximum Speed: 400 meters / minute
- Maximum Power Source: 360 W
- Diameter of holes: From 0.07 mm to 0.2 mm
- Signal Resolution: 10 micro seconds
- Maximum pulse frequency: 30 kHz
- Cooling System: Liquid / Air
